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新闻资讯

NEWS CENTER

资讯分类
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行业观察 半导体行业盛会集体开幕 厂商将加快国产替代步伐

  • 分类:行业资讯
  • 作者:小编
  • 来源:
  • 发布时间:2024-11-21 02:06:10
  • 访问量:

【概要描述】  2024 年前三季度中国大陆主要半导体制造设备进口总额达230亿美元,同比增加31%■,以光刻机为代表的核心设备仍有着旺盛的需求,国内晶圆厂建设热度

行业观察 半导体行业盛会集体开幕 厂商将加快国产替代步伐

【概要描述】  2024 年前三季度中国大陆主要半导体制造设备进口总额达230亿美元,同比增加31%■,以光刻机为代表的核心设备仍有着旺盛的需求,国内晶圆厂建设热度

  • 分类:行业资讯
  • 作者:小编
  • 来源:
  • 发布时间:2024-11-21 02:06:10
  • 访问量:

  2024 年前三季度中国大陆主要半导体制造设备进口总额达230亿美元,同比增加31%■★,以光刻机为代表的核心设备仍有着旺盛的需求,国内晶圆厂建设热度不减。此外■◆,全球封装设备市场规模从2024 年开始恢复增长◆■◆,其中先进封装设备销售额在2024年预计增长10%以上,2025 年有望超过20%◆■,海外龙头设备公司在先进封装领域的收入持续高增长,而我国本土装备企业在封装领域起步较晚,仍具备较大的发展空间。多机构推测,四季度指引稳中有升■■★◆■■,预示行业或将进入旺季。

  然而■★◆◆◆,国产厂商在多类材料的自给能力低且主要为低端产品,而在强技术壁垒的高端材料领域★★■◆★◆,国产化能力较为薄弱。国内半导体产业强链、补链需求迫在眉睫。当前■◆★,中国大陆晶圆厂积极扩产◆★★◆,且有意调整供应链以分散风险■★■◆,国产厂商迎来更多导入机会◆◆★◆。先进制造技术发展对材料的需求不断深化,国产厂商可与客户联合研发,在实现国产替代的同时争取本土创新,并可利用本土优势快速响应客户需求。在自主可控情绪的催化之下,半导体设备及材料板块今年第三季度估值修复明显。

  博览会(IC CHINA 2024)于11月18-20日在北京·国家会议中心如期举办★■★■◆■;第十届国际照明论坛(SSLCHINA2024)、先进半导体技术应用创新展(CASTAS)也于18日在苏州国际博览中心开幕★◆◆◆★。多项活动同期举办◆◆◆★■,市场目光又重新聚集到半导体行业。

  从半导体上市公司整体业绩来看★★★◆,2024第三季度半导体设备公司整体营收同比增速为34.4%,仍保持在较高水平;毛利率为44.6%★◆■★,同比增加1.1pct。整体来看,半导体设备的确收节奏保持良好的状态,环比呈现持续增长的趋势◆◆★■。公司之间毛利率表现差异较大,主要与产品结构有关★■,预计随着规模及成熟度的提升,部分公司毛利率将恢复至正常水平。半导体零部件上市公司第三季度整体营收同比增速为39.7%◆◆,增速进一步提升◆◆。产能利用率的提升也带动了公司盈利能力改善,整体毛利率水平为28★★◆■■.7%◆★★■★,同比基本达到持平◆■■★■。今年以来,随着下游晶圆厂产能的扩充和产能利用率的提升,集成电路材料领域收入也得到了明显的改善。整体毛利率为28.3%★◆■■★◆,仍处在相对较低的水平■■◆◆■,但较上一季度环比增加0.5pct。

  数据显示,中国大陆目前为全球半导体材料第二大市场,2023年市场规模达130.85亿美元◆◆■■■★,同比增长0.89%◆■◆★;占比为19.61%,同比提升1.77个百分点。全球半导体材料市场主要由日本厂商主导,尤其是在硅片、掩膜板、光刻胶、靶材★■、环氧塑封料等关键材料领域,日本厂商更是占据绝大部份市场份额。半导体材料国产化率普遍偏低◆◆◆◆,进口替代空间广阔。

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blkj@benlitech.com
0576-85580770
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定期公告

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1

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